Multilayer PCB Has Even more Than Two Conductive Copper Layers

Multilayer PCB recieve more than 2 conductive copper levels which mainly comprise of inner coating cores, prepreg levels and copper foils and they? re melted together via heat and stress. Lamination process is probably the key to manage good quality of multilayer PCB, this process requires specific heat and pressure regarding specific amounts of time based on materials used to ensure the PCB board is manufactured properly.

The multilayer PCB is typically the development of the particular double sided PCB with increasing complexity and density associated with components, they granted the designers to be able to produce highly complex and compact brake lines and further growth of blind in addition to buried via hole technology has pressed these limits even further.

With the requirements of increased precision in a variety of programs, the demands of multilayer PCB keep increasing continuously lately. The typical apps of multilayer published circuit boards consist of Computers, Data storage, Cell phone transmitting, GPS technology, satellite tv systems and thus on.

multilayer pcb A-TECH is usually an experienced multilayer PCB manufacturer which often own complete multilayer PCB manufacturing process in house from inner layer, vacuum lamination to surface area finishes, it brings us more benefits in the opposition of global industry shares for multilayer printed circuit boards on quality, price and lead moment. Currently the proportion of multilayer PCB all of us manufactured is even more than 65%.

HDI PCB, the full name is Very dense Connect PCB, it requires very much higher wiring thickness with finer trace and spacing, smaller vias and larger connection pad thickness. Blind and buried vias? design is one of their noticeable feature. HDI PCB are widely applied for Cell phone, tablet computer, digital camera, GPS UNIT, LCD module and other different region.

A-TECH CIRCUITS gives HDI PCB production services to globally customers in typically the high end automotive market, medical computer industry, mobile, computing and defense industry.

Currently the advanced HDI technology we applied include: “Direct Laserlight Drill”(DLD) is going of copper layer by direct CO2 laser irradiation, out-do additional laser drilling with conformal mask, the copper primary laser drilling has the ability to of providing larger accuracy, better hole quality and much better efficiency for HDI projects. “Copper Filled” for special bunch microvia, “Laser Primary Imaging”(LDI) is especially designed for great line technology, to be able to eliminate dimensional stableness problem of art work caused by environment and material problems.